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DEEPX

Funding History

$0$132M$265M$397M$529M20242025
Valuation by funding round
Series C · 05/2024$529M

Overview

DEEPX is a South Korean semiconductor company that designs ultra-low-power AI chips (NPUs) for on-device, edge AI processing rather than centralized data-center AI. Its product line includes the DX-M1, DX-M1M, DX-M2 and DX-H1 chip families along with the DXNN software development kit, targeting applications such as smart cameras and vision systems, smart appliances, robotics, smart factories, smart cities, and video management systems.

According to the company's own account of its founding, CEO Lokwon Kim started DEEPX in 2015 out of a conviction that artificial intelligence should not remain concentrated in centralized data centers accessible mainly to wealthy, geographically privileged users, but should instead 'exist everywhere' by being embedded directly into everyday devices. DEEPX has since positioned itself as aiming to do for on-device AI what ARM did for mobile computing, through power-efficient chip architecture (a 2024 TechCrunch report on the company's Series C round separately described DEEPX as having been founded in 2018, a discrepancy this profile has not been able to independently resolve).

By 2024, per TechCrunch, DEEPX had roughly 65 employees and had raised on the order of $95 million cumulatively, including a Series B round around 2021 and an $80.5 million Series C round in May 2024. More recently, DEEPX has described itself as a 'Physical AI Infrastructure Company,' announcing partnerships with firms including Hyundai Motor Group Robotics LAB, Avnet Silica, AAEON, and Ultralytics, and per its own newsroom page, DEEPX hired Morgan Stanley in August 2025 (as reported by Bloomberg) to advise on funding ahead of a possible future IPO — indicating the company remained privately held as of that report.

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